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Better Workflows for All Engineers: From Structural Analysis to Multiphysics


No matter if you work at a small company or a multinational corporation, Computer-Aided Engineering (CAE) technology can enable you to identify potential failures, improve performance, and find opportunities for lightweighting and cost savings. Often design and engineering teams rely on slow iterative design cycles, with each cycle causing delays in the product development process, losing both money and competitive advantage.

Altair HyperWorks software is used at the world’s most innovative companies for the design and optimization of their products. It enables engineers to make better decisions, optimize designs and reduce the costs of physical testing.

Sounds great, but how do you go about training designers and design engineers to effectively use CAE software? And how do you perform the complex analysis and multiple physics simulations required to model product performance under real-world conditions?


Altair SimLab is an intuitive and easy to learn workflow platform that enables you to simulate structural and multiphysics problems without the complexity usually associated with finite element analysis (FEA) tools. This opens detailed structural analysis to all experience levels and brings Multiphysics to engineers already familiar with FEA.

SimLab is an automated and easy-to-use multiphysics simulation environment with bi-directional connections to parametric CAD systems for high-fidelity analysis of thick-walled parts, complex assemblies and fluid flow systems. Ideally suited for design engineers and simulation experts alike, SimLab automates every step of the simulation process from solid meshing and analysis to multiphysics co-simulation and interactive visualization.

Faster design exploration and validation is possible with syncing to popular CAD tools including CATIA, Pro/E, Siemens NX and SolidWorks. The workflows include the simulation of statics, dynamics, heat transfer, fluid flow, electromagnetics analysis, fluid-structure interaction, and electromagnetic-thermal coupling.



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